Classification:
Prologue:
Epilogue:

Carl;

In the presence of humitidy,  silver has a significant tendancy to migrate,
particularly with increaced temperature.  You'd want to be aware of this in
your product testing.   Alloying of the silver may reduce the occurance.
Silver filled epoxies have been used for repair purposes for many years.  You
may want to see what data exists on these (I know that most of them were fairly
high resistance,

Jim Herard
---------------------- Forwarded by Jim Herard/Endicott/IBM on 03-21-97 04:21 PM
 ---------------------------

        TechNet-request @ ipc.ipc.org
        03-21-97 02:59 PM


To: TechNet @ ipc.org@internet
cc: karl.sauter @ Ebay.Sun.COM@internet
Subject: FAB: Silver-Fill

We are considering use of silver-filled vias for some
via-in-SMD land applications.  These would be through
hole vias on .062" thru .200" thick boards, where the
vias need to be topped over and plugged from one side
only.  Who has experience with this and what vias
finished hole sizes work best?

Thank you.

Regards,
Karl Sauter
Sun Microsystems, Inc.
408 276-5499

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